Material: metl
Color: Gray
Size: 99mm * 60mm * 15mm
How to use :
Step 1 :Put the mainboard into the tin-planting card slot
Step 2 :Align the corresponding tin planting mesh with the right position
Step 3 :Put the solder paste into the stencil by scraper
Step 4 :Using hot air gun to blow solder paste until it melts
Package included :
1pcs x BGA Reballing Platform